Mold Flow and Thermal Analysis of Ball Grid Array Packages
碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 93 === The mold flow software C-MOLD and Moldflow are used to simulate the flow behavior of Fine-Pitch Ball Grid Array （FBGA） package during encapsulation. The molding behavior during encapsulation for different chip thicknesses and offsets of hole on the substrate a...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/22012935201528940896 |