Package Warpage and Stress Analysis of Stacked Die and Multi-Chip Package
碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 94 === The three-dimensional stacked package, vertically stacking more than two chips in a package, meets the demand of more functions and higher capacity. The structure of 3D package is more complicated than the single die package. Thermal expansion mismatch between...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/23997449215943207034 |