The study on reliability and optimization of IC package in temperature shack conditions of interface strength by the fuzzy logic in taguchi technique
碩士 === 和春技術學院 === 電機工程研究所 === 96 === In electronic packages, the crack existence may cause the structure damage subjected to the thermal loading. The electronic package can be considered as the composite structure because of the layer manufacturing. The thermal shear occurs in the interface of the l...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/00568231840427434575 |