Interfacial Reactions of Wire-bonded Gold Bumps with Aluminu Pads in Flip Chip Assembly
碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 95 === The effort of this study is to comprehend the interfacial reaction of gold bump and aluminum pad. Thermosonic bonding combines the ultrasonic bonding and thermo-compression bonding. In the process of bonding, substrates maintain 150~250℃. This bonding tempera...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/38919778417361813933 |