Warpage and Thermal Stress Analysis of Thin Small Outline Package
碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 95 === The finite element method (FEM) is used to construct both the linear and sequential processing model to simulate the package warpage and stresses of TSOP (Thin Small Outline Package) during assembly processes. The accuracy of the model is verified by comparing...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/16240539350273538720 |