Study on the Reliability of Thermosonic Flip Chip Bonding of Chips with Copper Interconnects on Flex Substrates
碩士 === 國立中正大學 === 機械工程所 === 96 === Thermosonic flip chip bonding method was applied to bond the chips with copper interconnects on a flex substrate with addition of non-conductive paste (NCP). Reliability tests which include high temperature storage (HTS), temperature cycling test (TCT), pressure co...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/57488925070362804673 |