Optimal Interface Strength of Lead Free Solder Ball to IC Package Subjected to High Thermal Loading and Electromigration
碩士 === 和春技術學院 === 電機工程研究所 === 98 === In the structures of IC package, Pb free solder ball is very important key. Solder ball may produce the void between interface of solder and package under electron movement and thermal condition. The interface becomes brittle. The reliability of electronic equipm...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/33827045581189437381 |