Ru as a diffusion barrier for sub-45-nm Cu contact plug
碩士 === 國立虎尾科技大學 === 材料科學與綠色能源工程研究所 === 97 === As the feature size in ultra-large scale integration (ULSI) continues to scale down, the liner resistance has dominated the performance of multilevel interconnection beyond the 45 nm technology node. The traditional tungsten contact plug is therefore fac...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/zz6467 |