The Effect of Temperature and Moisture Variation on Warpage and Stresses in the Electronic Package
碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 97 === The finite element method (FEM) is used to construct sequential processing model to simulate the package warpage and stresses due to the coefficient of expansion mismatch between layered materials of package during assembly and test processes. The induced pack...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73707207485017499616 |