A TSV Delay Meter for 3D ICs
碩士 === 國立交通大學 === 電子研究所 === 98 === The manufacturing cost of the advanced process technology rises rapidly; on the other hand, the design complexity of modern designs also increases. To conquer the high cost of a large scale design, the stacked 3D IC is developed. Through-silicon-vias (TSVs) are wid...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/82584110256095042380 |