Fe-Co-B-Ti-Nb High Entropy Thin Film for Copper Metallization
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 98 === To inhibit Cu diffusion in the interconnect, an effective diffusion barrier layer with high thermal stability, low electrical resistivity and good interface adhesion is demanded. Because the high-entropy alloy(HEA) has high thermal stability, low resistivity...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/a94585 |