TSV Count Minimization through Alternative Paths
碩士 === 中原大學 === 電子工程研究所 === 99 === In the design of three-dimensional integrated circuits (3D ICs), through-silicon-vias (TSVs) are used for data transfer across layers. However, TSVs act as obstacles during the stage of placement and routing and have a negative impact on chip yield. Therefore,...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/01760480627212741632 |