TSV Count Minimization through Alternative Paths

碩士 === 中原大學 === 電子工程研究所 === 99 === In the design of three-dimensional integrated circuits (3D ICs), through-silicon-vias (TSVs) are used for data transfer across layers. However, TSVs act as obstacles during the stage of placement and routing and have a negative impact on chip yield. Therefore,...

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Bibliographic Details
Main Authors: Chih-Hsien Kuo, 郭致顯
Other Authors: Shih-Hsu Huang
Format: Others
Language:zh-TW
Published: 2011
Online Access:http://ndltd.ncl.edu.tw/handle/01760480627212741632

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