TSV Number Minimization by Stacking Selection
碩士 === 中原大學 === 電子工程研究所 === 100 === Minimizing TSV (Through-Silicon-Via) number is very important in 3D IC design, because TSV will increase the cost and the area, impact the circuit reliability, and reduce the die yield. There is a demand to reduce TSV number effectively in 3D IC design. In this th...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/10669226322464384246 |