Structural stress simulation of the six-chip on module under temperature cycling and drop test conditions
碩士 === 國立屏東科技大學 === 材料工程研究所 === 101 === In this study, the material properties of molding compound, die attach film and organic substrate of the six-chip module, such as coefficient of thermal expansion, glass transition temperature, modulus and moisture absorption, were measured by DSC, TGA, TMA an...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/73996948207787784575 |