Interfacial reactions of Ag alloy wires with wire bonded pads for IC and LED packages
博士 === 國立臺灣大學 === 材料科學與工程學研究所 === 101 === Abstract Electronic packaging industry wire bonding technology in the first stage of diameter 20μm level package, in the past most of the major is to use as an Au wire bonding material. With Au Price from less than $ 300 per ounce in 2...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/ex7s83 |