Thin Film Solid-Liquid Interdiffusion Bonding of Zn4Sb3 Thermoelectric Material with Cu Electrode
碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 101 === With the importance of energy and environmental issues increase, recycling and reuse of waste heat become an important part of sustainable development.Additionly, when the electronic component size quickly significantly reduced, resulting in heat density inc...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/38386267472435650819 |