On-Chip 3D-IC Test System Design for Pre-bond, Post-bond, TSV Test and TSV Diagnosis Based on IEEE 1838 Standard
碩士 === 國立成功大學 === 電機工程學系 === 102 === 3D-IC uses the Through Silicon Via (TSV) technology to reduce the connection length between each other circuits and enhance I/O bandwidth. It is also suitable to heterogeneous integration for memory, logic and analog circuits. However, due to the stacked structur...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/fz97xh |