Preparation and Characterisitics of Electrochemical Atomic Layer Deposited Copper-Silver Alloy Film on Interconnection
碩士 === 國立虎尾科技大學 === 材料科學與綠色能源工程研究所 === 102 === This paper describes the formation of Cu and Cu-Ag nanofilms using electrochemical atomic layer deposition (EC - ALD), which combine atomic layer deposition (ALD) with underpotential deposition (UPD). Ag materials and technigues may ultimately be need t...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/65m42k |