Study on the Interfacial Reactions of Ag-alloy Stud Bumps for Flip-Chip Assembly
碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 103 === The pursuit of fine pin and precisely electronic package demand of developing trend lead first level packaging evolving wire bonding into flip chip packaging. Due to the progress of TSVs technology, 3D IC technology becomes a remarkable issue of our semicond...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/13477176222440484572 |