Studies of Cu Thin Film by Electrochemical Atomic Layer Deposition on Pattern Substrates
碩士 === 國立虎尾科技大學 === 材料科學與綠色能源工程研究所 === 103 === Preparation of the atomic layer films by an electrochemical atomic layer deposition is capable of gap filling. It can be potentially adopted for interconnect manufacturing for integrated circuit. The copper layer was deposited on a sputter-prepared Ru/S...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/34t42v |