Thermal Stability of Copper Film Prepared on a Tantalum Nitride/Tantalum Substrate by Electrochemical Atomic Layer Deposition
碩士 === 國立虎尾科技大學 === 材料科學與綠色能源工程研究所 === 103 === Copper has been used as interconnects in ultra-large scale integrated (ULSI) because Cu has a high resistance to electromigration and high electrical conductivity. Generally, Cu interconnection needs a barrier to prevent Cu diffusion due to the fast dif...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/v6h9ae |