The study of heat transfer of a Package-on-package assembly
碩士 === 國立成功大學 === 機械工程學系 === 104 === This study uses finite element software ANSYS15.0 to analyze the heat transfer situation of Package-on-Package(POP) assembly. We observe the temperature distribution of the POP assembly, and change the power of the logic chip and memory chip to observe the influe...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/77612457575828550397 |