The study of heat transfer of a Package-on-package assembly

碩士 === 國立成功大學 === 機械工程學系 === 104 === This study uses finite element software ANSYS15.0 to analyze the heat transfer situation of Package-on-Package(POP) assembly. We observe the temperature distribution of the POP assembly, and change the power of the logic chip and memory chip to observe the influe...

Full description

Bibliographic Details
Main Authors:	Ching-HungChou, 周景弘
Other Authors:	Gien-Huang Wu
Format:	Others
Language:	zh-TW
Published:	2016
Online Access:	http://ndltd.ncl.edu.tw/handle/77612457575828550397

id	ndltd-TW-104NCKU5489065
record_format	oai_dc
spelling	ndltd-TW-104NCKU54890652017-10-01T04:30:09Z http://ndltd.ncl.edu.tw/handle/77612457575828550397 The study of heat transfer of a Package-on-package assembly Package-on-Package封裝體之熱傳研究 Ching-HungChou 周景弘碩士國立成功大學機械工程學系 104 This study uses finite element software ANSYS15.0 to analyze the heat transfer situation of Package-on-Package(POP) assembly. We observe the temperature distribution of the POP assembly, and change the power of the logic chip and memory chip to observe the influences. Gien-Huang Wu 吳俊煌 2016 學位論文 ; thesis 81 zh-TW
collection	NDLTD
language	zh-TW
format	Others
sources	NDLTD
description	碩士 === 國立成功大學 === 機械工程學系 === 104 === This study uses finite element software ANSYS15.0 to analyze the heat transfer situation of Package-on-Package(POP) assembly. We observe the temperature distribution of the POP assembly, and change the power of the logic chip and memory chip to observe the influences.
author2	Gien-Huang Wu
author_facet	Gien-Huang Wu Ching-HungChou 周景弘
author	Ching-HungChou 周景弘
spellingShingle	Ching-HungChou 周景弘 The study of heat transfer of a Package-on-package assembly
author_sort	Ching-HungChou
title	The study of heat transfer of a Package-on-package assembly
title_short	The study of heat transfer of a Package-on-package assembly
title_full	The study of heat transfer of a Package-on-package assembly
title_fullStr	The study of heat transfer of a Package-on-package assembly
title_full_unstemmed	The study of heat transfer of a Package-on-package assembly
title_sort	study of heat transfer of a package-on-package assembly
publishDate	2016
url	http://ndltd.ncl.edu.tw/handle/77612457575828550397
work_keys_str_mv	AT chinghungchou thestudyofheattransferofapackageonpackageassembly AT zhōujǐnghóng thestudyofheattransferofapackageonpackageassembly AT chinghungchou packageonpackagefēngzhuāngtǐzhīrèchuányánjiū AT zhōujǐnghóng packageonpackagefēngzhuāngtǐzhīrèchuányánjiū AT chinghungchou studyofheattransferofapackageonpackageassembly AT zhōujǐnghóng studyofheattransferofapackageonpackageassembly
_version_	1718541974458335232

The study of heat transfer of a Package-on-package assembly

Similar Items