The study of heat transfer of a Package-on-package assembly
碩士 === 國立成功大學 === 機械工程學系 === 104 === This study uses finite element software ANSYS15.0 to analyze the heat transfer situation of Package-on-Package(POP) assembly. We observe the temperature distribution of the POP assembly, and change the power of the logic chip and memory chip to observe the influe...
Main Authors: | Ching-HungChou, 周景弘 |
---|---|
Other Authors: | Gien-Huang Wu |
Format: | Others |
Language: | zh-TW |
Published: |
2016
|
Online Access: | http://ndltd.ncl.edu.tw/handle/77612457575828550397 |
Similar Items
-
Assembly Transfer Technology in Designs and Applications of Novel MEMS Packaging
by: Hung-Da Lin, et al.
Published: (2004) -
Analysis of heat transfer for packaged IC
by: Lin,Sue-Mei, et al.
Published: (1998) -
The Synthesis of Silcone Resin and LED Packaging Application
by: Shu-Hung CHou, et al.
Published: (2013) -
The study of heat transfer of PBGA package with Thermal Enchancement
by: Chieh-Wei Hsu, et al.
Published: (2008) -
Package Warpage and Stress Analysis of Stacked Die and Multi-Chip Package
by: Chien-Hung Chou, et al.
Published: (2006)