Intermetallic Phases Formation Mechanism of Cu Wire Bonding and Phase Equilibrium Study of Ag Wire Bonding in the Electronic Packaging
博士 === 國立中山大學 === 材料與光電科學學系研究所 === 104 === For lower cost considerations, copper wire bonding has been applied in IC packaging in recent years. In this study, the intermetallics(IMCs) formed, growth and crack development were examined to evaluate the reliability of several copper wires with/ without...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/ru5ky5 |