Preparation of Cu(Mn) Thin Films on Pattern Substratesby Electrochemical Atomic Layer Deposition
碩士 === 國立虎尾科技大學 === 材料科學與工程系材料科學與綠色能源工程碩士班 === 104 === Copper metallization needs comformal deposition in a high aspect-ratio gap / holewhen the device continents to scale down. Electrochemical atomic layer deposition has been used to deposit film layer by layer to meet the requirement for Cu inter...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/67xtpb |