Effect of process parameters on the surface morphology and mechanical performance of silicon structures after deep reactive ion etching (DRIE)
The ability to predict and control the influence of process parameters during silicon etching is vital for the success of most MEMS devices. In the case of deep reactive ion etching (DRIE) of silicon substrates, experimental results indicate that etch performance as well as surface morphology and po...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
2002.
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| Subjects: | |
| Online Access: | Get fulltext |