Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based pastes, with different Ag NP contents, onto organic s...

Full description

Bibliographic Details
Main Authors: Gyuwon Jeong, Dong-Yurl Yu, Seongju Baek, Junghwan Bang, Tae-Ik Lee, Seung-Boo Jung, JungSoo Kim, Yong-Ho Ko
Format: Article
Language:English
Published: MDPI AG 2021-01-01
Series:Materials
Subjects:
low-temperature bonding
laser process
Ag nanoparticle (Ag NP)
interfacial reaction
intermetallic compounds (IMCs)
mechanical property
Online Access:https://www.mdpi.com/1996-1944/14/2/335

Internet

https://www.mdpi.com/1996-1944/14/2/335

Similar Items