Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate

Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate

This study reports a CMOS-MEMS condenser microphone implemented using the standard thin film stacking of 0.35 μm UMC CMOS 3.3/5.0 V logic process, and followed by post-CMOS micromachining steps without introducing any special materials. The corrugated diaphragm for the microphone is designed and imp...

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Bibliographic Details
Main Authors: Ming-Chuen Yip, Weileun Fang, Jhyy-Cheng Liou, Li-Che Chen, Ming-Yi Wang, Shaoyi Wu, Li-Chi Tsao, Tsung-Min Hsieh, Chien-Hsing Lee, Chien-Hsin Huang
Format: Article
Language:English
Published: MDPI AG 2011-06-01
Series:Sensors
Subjects:
CMOS-MEMS
condenser microphone
corrugated
sensitivity
diaphragm
Online Access:http://www.mdpi.com/1424-8220/11/6/6257/

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http://www.mdpi.com/1424-8220/11/6/6257/

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